New 'cooler' technology offers fundamental breakthrough in heat transfer for microelectronics

In this diagram of the Sandia Cooler, heat is transferred to the rotating cooling fins. Rotation of the cooling fins eliminates the thermal bottleneck typically associated with a conventional CPU cooler. (Diagram courtesy of Jeff Koplow)

(PhysOrg.com) -- Sandia National Laboratories has developed a new technology with the potential to dramatically alter the air-cooling landscape in computing and microelectronics, and lab officials are now seeking licensees in the electronics chip cooling field to license and commercialize the device.